MultiPrep - The Copper Adhesion Process for Soldermask, Dry Film and Liquid Photoresist That "Sticks and Grips"
MacDermid is proud to feature MultiPrep-revolutionary copper surface preparation for improving adhesion of soldermask, dry film and liquid photoresists. The unique cupric chloride based chemistry generates high-texture uniform roughness on many copper surfaces while maintaining wide process latitude and overall manufacturing efficiency. View Article

MultiFlex - Lower Stress For Better Adhesion. Flex Technology You Can Trust
MacDermid's MultiFlex process is an innovative alternative to traditional electroless copper systems specifically designed for plating flex and rigid-flex substrates. The formaldehyde-free MultiFlex copper bath operates at a low pH suitable for alkaline sensitive flexible substrates like polyimide. The unique electroless/electrolytic copper deposit provides consistent coverage and excellent mechanical properties for unparalleled reliability.

MacuSpec VF 100 - PTH And Micro Via-bility In A Single Bath
Planarization, short bath life, and double processing are a thing of the past. The latest addition to MacDermid's acid copper plating portfolio, MacuSpec VF 100, simultaneously plates through holes and fills blind microvias. The process is pattern or panel plate capable and does not require any extraordinary mechanical additions to the standard copper plating cell. The copper deposit is thermally reliable, meets all IPC and JESD specifications. MacuSpec VF 100 has an unprecedented capability to fill vias of various sizes and geometries on the same panel using one plating recipe. With a wider operating window, the ease of operation is ensured. View Article

Eclipse - The Ultimate Choice For Mission-Critical PTH Reliability
Eclipse - RoHS, REACH and other environmental initiatives are taking effect across the world. PWB fabricators must be compliant with the new regulations while trying to increase the level of technology to meet the requirements of the end users. These two drivers are no longer mutually exclusive. MacDermid's Eclipse is the revolutionary direct plate system that incorporates the latest innovations in metallizing through holes and blind microvias to provide reliability that can surpass electroless copper. The new benchmark in PTH metallization, carbon based Eclipse features 10:1 aspect ratio and higher PTH capability and achieves over 500 IST cycles. This cost effective system drastically reduces cycle time, chemical consumption and water usage. The elimination of chelated heavy metals, formaldehyde and the reduction of waste makes the Eclipse the most environmentally responsible metallization process on the market today. View Article

M-Coat HT - Consistent, Simple And Economical- All In One Package. Finally.
Introducing MacDermid's M-Coat HT, the new high-temperature OSP, formulated and engineered to provide optimal solder wetting, maximum durability in lead-free reflows, and superior wavesolder hole-fill performance. Compatible with existing OSP equipment, M-Coat HT brings our customers lower operating costs, excellent thermal resistance, and MacDermid's globally renowned technical service. View Article

M-System Omega - Interconnect Reliability You Can Trust
Building on MacDermid's production proven M-System electroless copper process, M-System Omega  is the latest development in high reliability PTH processing. Advanced resin systems coupled with higher reliability demands from OEMs have placed more challenges on the PTH process and M-System Omega is the answer. Our patented activation system in conjunction with our new electroless copper M-Copper Omega, is capable of passing six times solder shock, ten times solder shock, and achieving higher cycles to failure.

M-Copper 15 - One Up or Basket, Performance Assured
M-Copper 15 is the most recent thin deposition electroless copper available from MacDermid. This cost effective product offering plates a uniform, pink, fine grained deposit on all substrates. The wide operating window of M-Copper 15 make this product a perfect fit for 1-up in line flash or basket processing.

RFID Smart Cards - Smart Plating For New Technology
Smart cards/tags have been described as one of the emerging technologies for the next 5-10 years. Of course, many people have heard of the Wal-Mart mandate where they are demanding smart tags from their suppliers for pallet and individual product identification. Other industries which are
committed to this technology include such diverse applications as livestock tracking industry, Department of Defense and banks.

In most cases the identification is performed by a remote reader system that relies on radio frequency waves to communicate between the reader and the tag. One of the major costs of the tag is the antenna required for the communication.

MacDermid has developed a new process of manufacturing the antenna which will help suppliers reach the goal of under 5 cents per tag. This process involves patterning a catalytic ink which initiates copper additive plating on the tag substrate and allows the manufacturer to generate the conductivity needed for the optimum performance of the antenna. The advantage of the copper plated antenna is its superior conductivity vs other so-called conductive inks.