Through Hole Metallization  
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Metallization > Through Hole Metallization
  Through hole metallization is the methodology for making holes conductive. A simple definition that encompasses several individual processes. The materials of today are designed for thermal management and dimensional stability. To achieve the requirements necessary, these materials have become more chemically resistant, thus more difficult to desmear, more difficult to make conductive.
 

Desmear
Reliable, void free coverage starts with the proper desmear process. MacDermid's M-Permanganate desmear process, along with MacDermid's patented permanganate regeneration system provides reliable desmear with maximum topography. The combination of reliable desmear and topography are prerequisites for subsequent metallizations steps that will ensure the best coverage and highest copper to resin adhesion values.

  Electroless Copper
Electroless copper has been the manufacturing standard for over 30 years, and MacDermid has been there since the beginning. Early innovations led to the development of the M-Systems/M-85, our highly successful heavy deposition electroless copper process. For the past 12 years, this process has become the industry standard for void free coverage. Maintaining the patented pretreatment system, MacDermid has developed the M-System Omega process, which takes copper to copper adhesion to a new level.
  Direct Plate
The demand for lower costs and more environmentally friendly processes has generated a need for alternatives to conventional electroless copper processing. MacDermid responded with the patented Blackhole direct plate technology. The Blackhole direct plate technology eliminates heavy metals, formaldehyde and cyanide, while reducing operating costs. This horizontal process makes through holes and blind vias conductive utilizing a carbon black technology. This carbon black technology allows electrolytic copper to plate directly to the interconnects, yielding high copper to copper adhesion.
   
   
   
   
   
   
   
 
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