MultiFlex
MacDermid MultiFlex is formaldehyde and cyanide-free electroless copper process. It provides the ultimate through-hole reliability and material compatibility superior coverage and adhesion with minimal waste.

• Compatible with all alkaline-sensitive materials
• Direct copper-to-copper bonding improves reliability
• No formaldehyde
• Engineered for reliabilty and performance
• Plates only non-conductive surfaces
• Low chemical consumption
• Minimal waste generation

MacuDep HDI
MacDermid MacuDep HDI is a horizontal electroless process that provides unmatched uniformity on even the most critical, high reliability materials and complex structures. Utilizing a patented colloidal activation sequence, it enables catalytic activity without expensive reduction steps. And most of all, MacuDep HDI enables users to confidently master the art of handling more complicated board designs to achieve greater profitability.

• Revolutionary activator control provides unmatched stability
• Conditions difficult halogen-free, high temp, flex substrates
• Optimal solution delivery for thin panels, dense vias
• Lowest total operating cost
• Highest reliability electroless copper

M-Copper 15
MacDermid M-Copper 15 is the thin deposition electroless copper developed specifically for fabricators that require process flexibility and reduced overall chemical costs in the development of their super thick circuit boards.

M-Copper 15, able to plate 15 microinches in 15 minutes, is impervious to bath loading and can be utilized in either basket mode or 1-up in-line for ultimate flexibility. With a load factor of 0.20 – 1.75 square feet per gallon, the reduced amount of chemicals used in the plating bath enables each shipment to last longer. Highly reliable, M-Copper 15 is engineered for low deposit stress, resulting in superior hole wall adhesion. It also features lower hydrogen evolution,which delivers a more uniform electroless copper deposition in the center of high aspect ratio holes. Using the same activation sequence as our renowned
M-System products,M-Copper 15 is the right choice for all of your highest technology circuit board projects.

• Low deposition copper thickness
• Outstanding performance for all levels of technology; ideal for circuit boards of 40 layers or more
• Process flexibility: basket or 1-up, in-line
• Reduces overall chemical usage
• Low deposit stress for superior hole wall adhesion
• Maximizes cost efficiency

M-System
MacDermid's M-System metallization process combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post pattern plate backlight performance. The statistically designed electroless copper bath, when used with enhanced solution transport will produce the highest yields on high aspect ratio holes and blind microvias.

The increased functionality of the newest resins systems present another set of challenges. Although the higher temperature resins meet designer specifications, they tend to be more chemically inert and more difficult to process. To meet these new processability and reliability benchmarks, MacDermid has developed a system to overcome these obstacles.

M-System Omega
The M-System Omega, builds on the commercial success of its predecessor, M-85. The M-System Omega delivers the same void free coverage as the industry accepted M-85, but goes another step in providing unparalleled interconnect reliability. M-System Omega easily passes the interconnect Stress Testing (IST), 6 times solder shock or 10 times solder shock. The bond between the interconnect and the electroless copper is so strong, that the innerlayer high temperature elongation foil (HTE) will fracture before the electroless interconnect will fail.

Through Hole Metallization and Electroplate Technology.