M-System
MacDermid's M-System metallization process combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post pattern plate backlight performance. The statistically designed electroless copper bath, when used with enhanced solution transport will produce the highest yields on high aspect ratio holes and blind microvias.
The increased functionality of the newest resins systems present another set of challenges. Although the higher temperature resins meet designer specifications, they tend to be more chemically inert and more difficult to process. To meet these new processability and reliability benchmarks, MacDermid has developed a system to overcome these obstacles.
 M-System Omega
The M-System Omega, builds on the commercial success of its predecessor, M-85. The M-System Omega delivers the same void free coverage as the industry accepted M-85, but goes another step in providing unparalleled interconnect reliability. M-System Omega easily passes the interconnect Stress Testing (IST), 6 times solder shock or 10 times solder shock. The bond between the interconnect and the electroless copper is so strong, that the innerlayer high temperature elongation foil (HTE) will fracture before the electroless interconnect will fail.
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