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Metallization > Electroplate Technology > Copper Electroplate
 

MacuSpec VF 100
MacDermid MacuSpec VF 100 is a unique, production-proven process that is specifically engineered to be the most effective method to simultaneously plate through holes and fill blind microvias in one bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, it eliminates an entire process sequence for greater application flexibility, while increasing overall bath life 400%.


Stacked via package substrate

  • Simultaneously fills blind microvias and plates through holes
  • Optimized for pattern and panel plate capabilities
  • Minimizes copper deposition of the surface, eliminating need for planarization
  • Increases overall bath life 400%
  • Reliable thermal cycle performance
  • Wider operating window
  • Meets IPC specification

MacuSpec
The MacuSpec product line contains DC copper additives for standard technology as well as high throw formulations.

For the highest performance, and special applications, MacDermid offers the MacuSpec PPR and MacuSpec PPR 100 for all types of pulse wave forms. Superior microdistribution, improved physical properties and decreased cycle time are the attributes to this industry leading product line.




42-layer high aspect ratio through-hole, 0.4 mm diameter in 6.4 mm thick PCB.




 
Through Hole Metallization and Electroplate Technology.