MacuSpec
The MacuSpec product line contains DC copper additives for standard technology as well as high throw formulations.

For the highest performance, and special applications, MacDermid offers the MacuSpec PPR and MacuSpec PPR 100 for all types of pulse wave forms. Superior microdistribution, improved physical properties and decreased cycle time are the attributes to this industry leading product line.

42-layer high aspect ratio through-hole, 0.4 mm diameter in 6.4 mm thick PCB.

ViaFill
Via filling is an emerging technology driven by the increasing density of array packages. Filling these blind microvias with copper offers many advantages. MacDermids leads the way with ViaFill. ViaFill is a process to copper fill microvias, using a special additive package in conventional direct current mode