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Interconnect > Rack & Barrel Tin and Tin / Lead
 
StanTek: Rack and Barrel Plating
TinMac HT
Our sulfate based, bright acid tin process for rack
and barrel applications. This chemistry can be
operated at elevated temperatures with no
chilling required. Excellent throwing power
and solderability is maintained throughout its
bath life.

Matte Tin

StanTek BMAT: A versatile plating system capable of plating tin and tin/lead in both high speed and rack/barrel applications.

StanTek MAT 2000: A pure tin, sulfate based acid process. This process exhibits high throwing power and simple process control

StanTek PC 1000: A tin and tin/lead plating system specifically formulated for the plating of passive surface mount components (product name should be a link to the page


Reel to Reel Applications | Passive Component Applications | Rack & Barrel Applications