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| Precision Control For Your Evolving Needs |
MacDermid StanTek PC 1000 is the matte tin and tin/lead process developed specifically to satisfy the increasingly stringent plating needs of passive component platers.Miniaturization trends demand a plating process that consistently delivers solderability, thickness control, and reduced chip twinning; StanTek PC 1000 delivers on these needs. StanTek PC 1000 is our low-foaming electrolyte that provides uniform thickness distribution; it operates at an elevated pH that won’t affect sensitive substrates.
Plating consistently and reproducibly throughout its bath life, it delivers tin or tin/lead alloys only to terminations, minimizing overplate. Grain-size consistency ensures optimal solderability,and excellent control throughout the life of the electrolyte. StanTek PC 1000 is applicable
for barrel, RFT, and other plating equipment, and is supplied with a full line of pretreatment chemistries. For exceptional process control and service that make a difference, count on the company that says “Yes We Can.” MacDermid.
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| Stantek PC 1000 |
Competitive Chemistry |
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| Plating beyond the termination is minimized with StanTek PC 1000. |
| Exceptional Solderability |
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StanTek PC 1000 was formulated to produce a large
and uniform grain structure. This grain is consistantly
delivered across a wide current density range and
throughout the life of the electolyte, assuring excellent
solderability of surface mount components. |
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| Reel to Reel Applications | Passive Component Applications | Rack & Barrel Applications |
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