MacDermid's intensive R&D efforts have produced a premier offering of photoimageable materials for use in the printed circuit industry. These include high resolution, primary image dry films and liquid photoresists, as well as an advanced laser imaging resist. These products and innovations have brought extensive benefits for high yield and low cost production of printed circuits.

MacDermid offers a full range of dry film photoresists to meet all of our customers requirements, such as high yield processing, laser direct imaging, and final finish processing. Each of our products offers some advantages to the customer versus our competitors.

Liquid Resist

High yield innerlayer and outerlayer processing - Customers are being pushed to higher density fine line circuitry. Yield normally drops when this transition takes place, and board fabricators must choose a resist that provides higher yields, and allows them to remain competitive.

Laser direct imaging - Shops in North America and Europe (our target market for dry film) are replacing much of their high volume work with a greater numbers of innerlayer designs part numbers) of smaller volume. Laser digital imaging is replacing conventional imaging for this type of work because of lower phototool costs (phototools are the things that make the image on the circuit board).

Final finish processing - Harsher chemicals are being used in Final finish plating, MacDermid resists excel in it’s resistance to these chemicals.