MacDermid MacStan HSR 3.0 is the immersion tin plating process designed specifically to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months.

MacStan HSR 3.0 is another high performance product from the leader in final finishes. It offers a chemically stable, low foaming and efficient application process that delivers excellent Pb-free solderability and an extremely planar surface. Exceptionally reliable with a high resistance to corrosion, MacStan HSR 3.0 enables effortless thickness control while maximizing bath and process stability. This ultimately results in higher yields and less overall waste. Fabricators, assemblers, and OEM’s can trust MacStan HSR 3.0 to help them meet both RoHS requirements and WEEE directives.

• Inhibits whisker formation
• Exceptional solderability
• Tin deposit with extended shelf life
• Process simplicity with minimal tin oxidation
• Corrosion-resistant
• Ideal for compliant pins and press-fit connectors

Reliable. Long Lasting. Lead-free. For All Applications.

MacStan HSR 3.0 provides fabricators, assemblers, and OEM’s with the immersion tin plating process they can consistently rely on for critical, high performance applications. Formulated to minimize whisker risk, its durability to multiple reflows, easy process control, and extended shelf life provide everything you can expect from the leader in final finishes, including uniform coverage throughout difficult blind vias and microvias.






MacStan HSR 3.0's proprietary additive package is specifically formulated to minimize the risk of whisker growth,assuring consistent and reliable coating performance.

MacStan HSR 3.0 dependably
delivers coverage in high
aspect ratio applications,
maximizing yields for even the
most complex board designs.







MacStan HSR 3.0 delivers excellent solderability even through exposure to harsh environments.