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Reliability And Stability
From A Single High Yield
ENIG Plating Process
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 MacDermid Planar is the electroless nickel immersion
gold plating process designed specifically to increase yields
through the elimination of extraneous and skip plating, while
preventing black pad. Favored by fabricators, assemblers
and OEM’s because of its stability and reliability, Planar is
the choice for critical end-use applications.
Planar’s patented catalyst systems are what separate Planar
from the competition. They selectively metallize copper
surfaces only, which directly eliminates both extraneous
plating and skip plating. Formulated by the industry experts
in black pad elimination, its high performance Ni structure
resists corrosion and is exceptionally compatible with solder
masks, improving downstream performance. Combined with
our full range of electroless nickel products, Planar provides
a durable, extremely flat deposit ideal for fine pitch SMT, BGA
and direct-chip attach assembly.
When reliability, stability and high yield are critical,
count on the company that says “Yes We Can.”
MacDermid |
KEY FEATURES
• No plating on laminate or solder masks
• No skip plating
• Ni structure that resists corrosion
• Compatible with solder masks
• Formulated to prevent black pad
• Excellent solderability, contact resistance
and wire bondability
• Simplified bath control |
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| We offer a range of products for applications including Immersion Silver, Immersion Tin, Electroless Nickel,/Immersion Gold, OSP |
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