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Final Finishes > Electroless Nickel / Immersion Gold
 
Reliability And Stability From A Single High Yield ENIG Plating Process
MacDermid Planar is the electroless nickel immersion gold plating process designed specifically to increase yields through the elimination of extraneous and skip plating, while minimizing the risk of black pad. Favored by fabricators, assemblers, and OEM’s because of its stability and reliability, Planar is the choice for critical end-use applications.

Planar’s patented catalyst systems are what separate Planar from the competition.They selectively metallize copper surfaces only; this directly eliminates both extraneous and skip plating. Formulated by the industry experts in black pad elimination, its high performance nickel phosphorous structure resists corrosion and is exceptionally compatible with soldermasks.Combined with our full range of electroless nickel products, Planar provides a durable,extremely flat deposit ideal for fine pitch SMT, BGA and direct-chip attach assembly.

  • No plating on laminate or solder masks
  • No skip plating
  • Nickel structure that resists corrosion
  • Patented technology to overcome harmful solder mask effects
  • Formulated to prevent black pad
  • Excellent solderability, contact resistance and wire bondability
  • Simplified bath control

Planar: From The Leader In Final Finishes

For more than 10 years,MacDermid has been a leader in electroless nickel immersion gold. And when it comes to reliability, stability, and high yield from a single ENIG plating process, look no further than MacDermid Planar. .




Planar is formulated to deliver consistent performance
throughout its extended bath life.With conventional processes,
solder mask materials leach into the nickel bath chemistry,
resulting in increased nickel rates and reduced phosphorus
content. Planar is formulated to prohibit this effect, improving
bath stability and minimizing black pad risk.

 

 

Specified by fabricators, assemblers, and OEM’s worldwide,Planar is a superior HASL alternative designed specifically to minimize the mechanisms that can lead to black pad while reducing extraneous and skip plating. Reduce failure rates throughout the entire process with Planar, from the leader in final finishes.

Planar’s patented activation systems assure nickel gold plating only where you want it.

Conventional systems can result in catalyst
adsorbtion in unwanted areas, resulting in
extraneous plating.

Planar’s corrosion
resistance directly
prevents black pad.


Cyanide stripping of
standard ENIG shows
“cracked earth” appearance.

 




We offer a range of products for applications including Immersion Silver, Immersion Tin, Electroless Nickel,/Immersion Gold, OSP