The Printed Circuit Board manufacturing process consists of an intricate series of chemical processes. The processes are interrelated, with the highest quality depending on the efficient operation of each step.
Use this PCB Process Map to find the product you’re interested in.
To view a description of the process step, click the schematic icons on the left.
To view the web page specifically detailing a certain product, click the appropriate linked product name.
To see the complete list of available product brochures in PDF form, click here to go to the Information Center page.
To return to this page, click “Fabrication Process” in the left menu bar on any other Electronics Solutions page.
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Clean Cores
CoreClean and MacGleam, part of the Coresystems process family
Circuit Formation Product Group
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Inner layer Film
Aqua Mer family of photoresists for a variety of applications
Microtrace next generation liquid innerlayer resist
Imaging Product Group
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Expose Develop
Developer 45, part of the Coresystems process family
Circuit Formation Product Group
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Etch
UltraEtch series, from the innovator of alkaline etching
Circuit Formation Product Group
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Strip Resist
UltraStrip and UltraGen for uncompromising multi-process compatibility
Circuit Formation Product Group
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Oxide
OmniBond Plus traditional oxide and controlled dissolution innovation
MultiBond series of oxide alternatives for low-etch, Pb-free compatibility
Circuit Formation Product Group
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Laminate
MacDermid’s processes are optimized to provide the widest lamination window possible with all substrate technologies
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Drill
For laser microvia formation or mechanical drilling in high production, MacDermid’s processes help you achieve maximum productivity.
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Desmear
Desmear complete desmear/etchback, glassetch and neutralize system
Metallization Product Group
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Plate Through Hole
Blackhole, the world’s leading direct metallization system
M-System electroless Cu allows for the most stringent reliability demands
Metallization Product Group
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Outerlayer Resist
Aqua Mer outerlayer resists in a variety of thicknesses
Imaging Product Group
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Electroplate Copper
MacuSpec and Viafill acid copper plating
MacuSpec PPR periodic pulse reverse for high aspect ratio plated through holes and microvias
Metallization Product Group
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Plate Tin
ResTin electrolytic tin etch resists
Metallization Product Group
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Strip Resist
UltraStrip and UltraGen for uncompromising multi-process compatibility
Circuit Formation Product Group
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Etch
UltraEtch series of outerlayer copper etchants
Circuit Formation Product Group
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Strip Tin
Eliminator provides efficient tin stripping without copper attack
Circuit Formation Product Group
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Prep Copper
Microetch of surface prep provide uniform texture for this critical process step
Circuit Formation Product Group
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Soldermask
MacuMask and MacDermid’s processes before and following soldermask allow for optimum assembly and end-use reliability
Imaging Product Group
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Final Finish
Sterling, the world’s leading immersion silver finish
MacStan, innovative immersion tin technology
Planar electroless nickel immersion gold for black-pad prevention
M-Coat organic solderability preservative for optimal performance
Final Finish Product Group
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Interconnection
MacDermid’s wide range of Interconnection products for leadframe, pin, wire, and termination plating features StanTek processes
Interconnect Product Group
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