Circuit Formation

 
Metallization Circuit
Formation
Imaging
Systems
Final
Finishes
Interconnect Emerging
Technologies
OEM & Assembly Equipment
& Services
Circuit Formation
 
MacDermid's Circuit Formation Products Group focuses on the chemical technologies of imaging and defining circuit patterns - from the highest density, 2 mil L/S technologies to the systems integrations requirements of transporting ‹2 mil core thicknesses. This extensive group of products includes:
  • Oxide/oxide alternatives
  • Copper Cleaners
  • Developers
  • Resist Strippers
  • Etchants
  • Microtech

MultiBond horizontal equipment
Over the years MacDermid has introduced numerous innovations to these areas, and today we continue to develop processes that can help you obtain the ever-increasing densities necessary for BGA and HDI systems... as well as the bonding requirements for a whole new range of laminate systems.

We offer a range of products for applications including Multibond & Oxides, Surface Preparation, Developer, Resist and Solder Strippers, Alkaline Etchants and Core Systems.