Surface Preparation  
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Circuit Formation > Surface Preparation
 
CoreClean Process
CoreClean was developed as flexible surface preparation process for inner layers prior to the application of either dry film or liquid resist. It includes cleaners capable of removing the most tenacious chromate, zincate, and silane anti-tarnish treatments, and can be used with or without a microetch, and with or without antitarnish as suits the needs of the user.



MacGleam
MacGleam can be used as a one-step cleaner/microetch/antitarnish for preparing innerlayers or panel plate for photoresist application. It can also be used in a variety of other copper preparation processes. MacDermid also offers a line of special, patented products which improve surface insulation resistance.


MultiPrep
Our newest product for soldermask adhesion during final finish plating.
  1. Removes oxides from the surface.
  2. Etches copper at reliable and steady rate.
  3. Creates an adherent micro-etched topography of the copper surface.
  4. Provides an adhesion bonding mechanism for dry film.
Standard Microtech
Multiprep
Multiprep shows better topography for improved solder mask adhesion.
We offer a range of products for applications including Multibond & Oxides, Surface Preparation, Developer, Resist and Solder Strippers, Alkaline Etchants and Core Systems.
 
 
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