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MultiBond Process
MacDermid is a market leader in the development of high reliability bonding conversion coatings. The MultiBond process is the most widely used oxide alternative system in the world.
MultiBond
- Revolutionary multilayer bonding technology
- Over 150 installations worldwide
- Conveyorized, reliable thin core processing
- Complete resin systems capability, including High TG, Halogen Free, High Speed/High Frequency/Low Loss
- Compatible with "Lead Free " Assembly requirements
Specific functional performance data available upon request.
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| MultiBond LE |
Surface topology of MultiBond LE |
The next generation, MultiBond LE, is the ideal bonding process for controlled impedance inner layers. Up to a 80% reduction in concentrated copper waste compared with other systems. Low copper removal of 40 μ"; just one micron! This makes MultiBond LE the ideal bonding process for controlled impedance inner layers, and has proven compatibility with advanced resin systems.
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MultiBond LE... multilayer bonding technology that builds winners |
- Lowest copper removal
- Exceptional impedance control results
- Compatible with a full range of resins, including epoxies, polyimide, and hybrids
- Significant reduction reduction in copper waste volume
- Single proprietary replenisher
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OmniBond Plus+ |
| The OmniBond Plus+ process is the only production-proven oxide dissolution system offering pink ring elimination and greatly lower incidence of high-resistance shorts than DMAB reduced oxide. Both processes offer multi-resin compatibility for optimum process flexibility. |
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We offer a range of products for applications including Multibond & Oxides, Surface Preparation, Developer, Resist and Solder Strippers, Alkaline Etchants and Core Systems.
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