FIRST use of recyclable chemical components
FIRST production fine-line etchant
FIRST ‹2 mil L/S etching and ‹2 mil core transport without leaders

Ultra Etch FL
Ultra Etch FL is a high speed, moderate capacity,continuous alkaline etchant system used in the manufacture of fine line printed circuit boards. It will remove copper at an etch rate of 2.0 -2.5 mils per minute at 125°F (52°C), and can dissolve and hold copper in solution in the range of 12 to 18 oz/gal (90 to 135 gm/L).

This ammoniacal etchant shows excellent undercut characteristics for the production of very fine line circuitry commonly found on high density inner and outer layers of multilayer boards (under 5 mil lines and spaces on 1 oz base laminate). Many types of resists can be used including gold, nickel, tin, tin-nickel and tin-lead. Due to this system's low pH capability (7.6-8.4), alkaline strippable inks and aqueous dry films have been used successfully.

MacDermid pioneered many of the key chemistries and process parameters of alkaline etch systems.

Ultra Etch 20
Ultra Etch 20 is a high speed, moderate capacity ammoniacal copper etchant used in the manufacture of printed circuit boards. It etches at a rate of 2.5-3.0 mils/minute at 115-130F (46-54C) and has a copper capacity of 18-20 oz/gal(135-150 g/L). Its lower freezing point and excellent stability combine to make Ultra Etch 20 a trouble free solution.

Ultra Etch 50
Ultra Etch 50 is a high speed, high copper capacity alkaline etchant solution used in the manufacture of printed circuit boards. It will remove copper at an etch rate of 2.5-3.0 mils per minute at 130F (54C). It can dissolve and hold copper in solution in the range of 20-24 oz/gal. (150-180 g/L).

For over 20 years we have been the worldwide market leader in this technology, providing integrated chemistry/equipment systems, etchant recycling and accurate control systems