A dominant force in electronics development is the focus on environmentally friendly end-use product disposal. MacDermid is working closely with government, industry, and customer groups to eliminate lead in electronic equipment. In addition to a variety of environmentally friendly final board finishes, MacDermid has developed lead-free component finishes for interconnect applications. This lead-free R&D focus has produced a series of tin/copper, tin/bismuth and pure tin finishes specifically for plating electronic components.

Our Final Finish is committed to HASL alternative processes. Lead-free is a team focus. Sterling Silver, MacStan tin and new organic solderability processes will meet this lead-free need.