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Embedded Passives

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Emerging Technologies > Embedded Passives

As the value of circuit board surface "real estate" continues to rise, printed circuit board designers are investigating alternative technologies that can increase packaging density and improve board performance.

Embedded passive technology is a viable procedure that can successfully improve packaging density of a circuit board by burying, or embedding, resistors and capacitors. This process has also demonstrated an ability to improve the performance of high speed (gigahertz) circuitry with the reliance on shielded, embedded construction. Embedding resistors is also cost effective. The fabrication of a large number of embedded components tends to equal the cost of embedding one resistor. This contrasts to the incremental cost of placing a large number of chip resistors.

Selective, Additive Plated Embedded Resistor Technology

Patented alternative technology for increased packaging density, improved board performance, and reduced manufacturing costs.

Reliable Performance

M-Pass Specifications and Reliability Test Data
Sheet Resistance (Rs)	£ 100 ohms/square
Temperature Coefficient of Resistance (TCR)	< 100 ppm/ ° C
Environment Stress (1000 hr. @ 85 ° C/85%RH)	< 1% change
Liquid Shock (500 cycles, -35 ° C to +125 ° C)	< 1% change
Thermocycle (Precondition, 3X Reflow, 1000 hr/1000cycles: -40 ° C to +125 ° C)	< 1% change
8 Kv ESD Discharge	< 0.1% change
Mechanical Bend ( 200 cycles in both directions over 61 cm [ 24”] Mandrel)	< 1% change
Power Dissipation	Up to 310 mW/mm 2: [ 200 W/in 2 ]

Among MacDermid's leading edge research projects is the development of M-Pass, embedded resistor technology based on current board fabrication methods. This technology frees up space on the surface of circuit boards by using a proprietary deposition process. The chemistry for the of M-Pass process can be put into already existing equipment.

Embedding resistors is a very cost effective process. The ability to free up surface area on a circuit board continues to rise in value. Many embedded plated resistors can be produced for a small cost compared to the incremental cost of placing chip resistors on a circuit board. M-Pass offers a unique patented technology that replaces surface mount resistors with embedded passives, which allows for increased packaging density along with improved board performance.

M-Pass can also improve the performance of high-speed circuits, involving gigahertz applications. A wide variety of resistors can be designed with M-Pass depending on the ohms per square resistor requirements. Macdermid offers products for surface preparation, catalysis, and resistor deposition to carry out the of M-Pass process.

Also in development is a series of polymer thick films that will meet the needs of advanced printed circuit board designs. These polymeric systems can be applied by conventional screen or stencil printing techniques and are available in a wide range of resistive values.

Embedded Passives, Selective Additive Circuitry, InkJet Lithography, and Lead Free Technology