Plated Metal Conductors
Electroless, Electrolytic and Light Induced Plating Nickel, Copper, Silver and Tin

Plated metal conductors significantly out-perform sintered paste for conductivity, allowing finger width reductions to 25 microns or less. Select from electroless or electrolytic processing to achieve up to 1.5% increases (absolute) in cell efficiency compared to conventional cell manufacture, all at a reduced overall cost. The chemical deposition is compatible with laser and etch-resist techniques for exposing silicon through the anti-reflective coating.

Helios Electroless Nickel
The Helios family of electroless nickel solutions offers the PV designer a set of options for solar cell conductor formation. Achieve your target thickness at the optimal conditions for your process - without the equipment limitations and physical contacts of electroplating.

Helios Electroless Copper
From the experts in electroless copper, simplified and well-controlled copper deposition formulated specifically for the unique demands of photovoltaic cells. Maximum efficiency and longest bath life.

Helios Electrolytic Copper
Full build, high purity, low stress copper for fast deposition of up to 50 microns thickness. For the ultimate finger and busbar conductivity. Easily finished with silver or tin. Available in light-induced formulation as well.

Helios Electrolytic Nickel
Full build, high purity, low stress nickel for fast deposition of up to 20 microns thickness. Provides conductor formation without copper exposure.

Helios Electrolytic Silver
Highest conductivity metal conductor formation for use as the final coating on copper or nickel deposits.

Helios Electrolytic Silver Cyanide Free
Next generation silver deposition using high conductivity silver without the use of cyanide chelation.

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